MICROSOFT SURFACE PRO 8 LTE PLATINUM 1982 (01) PDF Document

The rSSD drive size and serial number for the MICROSOFT SURFACE PRO 8 LTE PLATINUM 1982 are located under the kickstand.

The following terms are used for servicing the MICROSOFT SURFACE PRO 8 LTE PLATINUM 1982:

rSSD – Removable Solid-State Drive

TDM – Touch Display Module is the complete screen with all layers.

THM – Thermal Module is an assembly with heat spreaders and electric fan.

TIM – Thermal interface material used between the THM and PCBA.

PCBA – Primary circuit board assembly

SoC – System-on-a-chip is a microchip with several electronic circuits and parts on a single integrated circuit.

PSA – Pressure Sensitive Adhesive

IBC – Tablet Back Cover

BMR – Bare Metal Recovery refers to the clean imaging process.

SDT – Surface Diagnostic Toolkit

ESD – Electro-Static Discharge

FRU – Field Replaceable Units are sub-system components such as the SIM/rSSD door, Kickstand, and rSSD. FRUs are available only to ASPs. Some replaceable units will only be available as FRUs and therefore are only supported at an ASP.

Commercial Spares/CRU – Customer Replaceable Units available to commercial customers for repair by a skilled-technician.

Microsoft Service Tools:

SIM eject tool (or equivalent 0.023 in / 0.58 mm diameter paperclip)

Surface dock

TDM PSA debonding tool (M1214770-001)

TDM PSA bonding frame (M1178722-001)

Surface Diagnostic Toolkit

Standard Service Tools:

Anti-static wrist strap (1 MOhm resistance)

Soft Electro-Static Discharge (ESD) safe mat

iFixit pick

iFixit opening tool

Spudger

Two 2 in spring clamps

TDM Bonding weight:

– Weight Requirement: minimum 23 kg (50 lb) / maximum 26 kg (57 lb)

– Minimum Dimensions: 280 mm x 200 mm (11 in x 8 in)

– Geometry must be symmetrical, to allow for even weight distribution.

– Weight used must be a flat plate, with consistent flatness and not protrude from contact plane with Bonding Frame.

– Weight must contact the full perimeter of the frame when placed above it.

– Recommended weights Ruck Plates of 9 kg + 14 kg (20 lb + 30 lb)

Foam pad:

– Material: EVA Foam

– Thickness: 9.5 mm (3/8 in)

– Density: 0.03 g/cm³ (2 lb/cu Ft)

– Dimensions: Minimum 229 mm x 305 mm (9 in x 12 in)

– Recommended foam pad (McMaster PN: 86095K43)

3IP and 6IP (Torx-Plus) drivers

Loctite SF 7649

Loctite 243

Isopropyl alcohol dispenser bottle (use 91% or greater IPA)

Cotton swab

USB drive

Wired Ethernet connection to the Internet

USB keyboard

Microfiber / lint free cloth

Always observe the following, general safety precautions:

Opening and/or repairing any electronic device can present a risk of electric shock, fire, serious personal injury, death, damage to the device or other property, and/or other hazards. Exercise caution when undertaking the repair activities described in this Guide. The repair activities identified in this Guide should only be undertaken by technically inclined individuals with the knowledge, experience, and specialized tools required to repair Microsoft devices.

Improper use or handling of devices or their batteries may result in fire or explosion. Only open the enclosure on a device as outlined in this Guide.

Do not heat, puncture, mutilate, or dispose of devices or their batteries in fire. Do not leave or charge devices in direct sunlight or expose devices or their batteries to temperatures outside the recommended operating range of 0° C to 60° C/32° F to 140° F for an extended period. Doing so can result in battery failure, electric shock, fire, serious personal injury, death, and/or damage to the device or other property.

We recommend wearing protective eyewear and gloves when disassembling/re-assembling a device.

Before opening the device, ensure it is powered off and disconnected from its power source. Disconnect the device charger or power cord from mains power.

For devices with rechargeable lithium-ion batteries that power on, fully discharge the battery before beginning repair. To expedite the battery discharge process:

– Disconnect the charger from the device.

– Increase display brightness to the highest level.

– Turn on wi-fi and Bluetooth.

– Open the Camera app in Windows.

– Play music or video files from a local drive or streaming service.

Operate the device in this mode until the battery is fully discharged and the device powers off.

For Surface devices where the battery is affixed to the back cover, place the back cover with the battery in a location where it will be protected from possible punctures, impacts, crushing, or drops during the repair process.

Additional Precautions:

– Ensure your work surface is level/flat and covered with ESD-safe, soft, non-marring material.

– We recommend wearing protective eyewear as a safety precaution when disassembling/re-assembling a device.

– Clean your work surface regularly to remove debris and abrasive particles.

– Before opening a device, always wear an anti-static wrist strap and confirm your work area is properly grounded to protect vulnerable electronics from electrostatic discharge (ESD).

– Parts removed from a device during the repair process should be stored in ESD-safe bags and packaged for return or recycling in the same packaging that the new replacement part came in.

– If battery damage (e.g., leaking, expansion, folds or other) is discovered during device repair or if the battery is impacted or damaged during replacement, DO NOT proceed.

– As you remove each subassembly from the device, place the subassembly (and all accompanying screws) away from the work area to prevent damage to the device or to the subassembly.

– During all activities check to ensure that no loose articles are on the back cover or remain inside the device before reassembling it.

– Remove rSSD (removable Solid-State Drive) whenever C-cover is removed from device. rSSD removal disconnects the battery from all device logical components for safety purposes.

– Whenever the rSSD has been removed, powering on the device requires that the rSSD and C-cover are installed.

The MICROSOFT SURFACE PRO 8 LTE PLATINUM 1982 contains a built-in, lithium-ion rechargeable battery. Battery safety is a significant concern when repairing a device.

Use genuine Microsoft replacement parts for optimum compatibility, performance, and product safety.

Before beginning device repair, ensure your workspace is free of flammable debris or materials, has adequate ventilation, and that you have a fire suppressant device (example: fire blanket, container of sand, Class B fire extinguisher) within easy reach or you are within 20 feet of a fireproof enclosure.

Use personal protective equipment (PPE) when handling damaged, venting, or hot battery packs.

Use the following best practices when handling batteries:

– Always fully discharge batteries by running an application such as video playback with the device unplugged. If the device does not function while unplugged, you may leave out this step.

– Do not puncture, impact, strike, bend, or crush the battery or a device containing a battery.

– Keep your workspace clear of debris, extra tools, and sharp objects.

– Exercise caution when using sharp tools near the battery to avoid impacting or poking the battery.

– Don’t leave loose screws or small parts inside the device.

– Avoid using tools that conduct electricity.

– Do not drop or throw a lithium-ion battery.

– Do not expose the battery to excessive heat, sunlight, or temperatures outside the battery’s normal operating range (0° C to 60° C)/(32° F to 140° F).

– Ensure you handle, recycle, and/or dispose of used or damaged batteries in accordance with local laws and regulations.

If device repair cannot be completed immediately and the device needs to be stored temporarily before restarting the repair:

– Select a storage location and process that follows the battery safety precautions in this Guide.

– Avoid exposing the device to environmental conditions and objects that could damage the battery pack.

– Reinspect the battery pack as outlined in this Guide prior to restarting repair and installing the new battery pack.

Upon opening the device, visually inspect the battery for signs of damage. Factors to consider when inspecting the battery include, but are not limited to:

– Evidence of leaking or venting

– Visible signs of physical or mechanical damage, such as:

– Expansion or swelling. In expanded or swollen batteries, the soft pouch encasing the cell pulls away from the inner material and appears baggy, loose, or puffy.

– Discoloration of the battery casing.

– Odor, smell, or visible corrosion. Leaked battery electrolyte smells like nail polish remover (acetone).

– Dents along the battery cell edges or on the top surface.

– Surface scratches that have exposed the aluminum beneath the black coating layer on the battery.

– Loose or damaged wires.

– Known misuse or abuse.

Any battery exhibiting these signs must be replaced.

DO NOT dispose of used lithium-ion batteries, whether damaged or not, in household or commercial garbage or recycling bins.

DO NOT SHIP DAMAGED OR DEFECTIVE BATTERIES ALONE OR INSIDE DEVICES. Damaged or defective batteries and devices containing damaged or defective batteries require special packaging and handling. Prior to transport:

– Follow all instructions provided by your local e-waste recycling or household hazardous waste collection provider.

– Place the device or battery in an individual, non-metallic inner packaging, such as a zip-to-close plastic bag, that completely encloses the device or battery.

– Surround the inner packaging with non-combustible, electrically non-conductive, absorbent cushioning material.

– Each damaged battery or device containing a damaged battery should be packed individually in its own carton and that carton should be clearly marked as containing a damaged battery.

Undamaged, used lithium batteries can be sent to e-waste recycling or household hazardous waste collection points for processing.

A thermal event is a rapid chemical chain reaction that can occur inside a battery cell, resulting in heating and/or smoke, and in some instances, fire or flame. Act immediately if you see any of the following symptoms:

– Smoke, soot, sparks, or flame emitted by the battery or from a device containing a battery.

– The battery pouch suddenly expands in size.

– A popping or hissing noise from the battery or a device containing a battery.

Actions to take:

– DO NOT use water. Immediately smother the battery or device with clean, dry sand, a fire blanket, or an appropriate (Class B) fire extinguisher. If using sand, dump the sand all at once until the device is completely covered.

– Contact local fire authorities if further assistance is needed.

– Exit the work area and ventilate it until it is clear of smoke.

– Wait at least 2 hours before attempting to touch the device.

– Dispose of the damaged battery or device in accordance with local environmental or e-waste laws and guidelines.

If any Microsoft device visually exhibits any of the following symptoms, cease all further repair efforts and contact Microsoft Surface Customer Support:

– Any burned or melted components, traces, or plastic parts on the outside of the device, or which otherwise exhibits heat damage, including charring seen in charging and other ports.

– Any burned or melted components, traces, or plastic parts on the inside of the device, or which otherwise exhibits heat damage.

– Any accessories exhibiting melting or heat damage that are included with the Microsoft device, such as power supplies, keyboards, mice, cables, charging connectors, etc.

– Any devices that exhibit a case that has separated apart or opened for reasons other than impact damage from dropping, evidence of tampering, or separation caused by a malfunctioning battery.

– Any other finding that may constitute a safety hazard to the user, such as sharp edges on plastics.

Device service part availability is segmented into two groups. FRUs are parts available for repair activity through an Authorized Service Provider under specific contract with Microsoft. CRUs/Spares are parts available for repair activity by a skilled technician.

The following approach should be considered when troubleshooting the device:

1. Update device to latest OS/FW versions using the SDT tool. Device updates are required as a prerequisite to all hardware replacement.

2. Verify any suspected hardware failures by setting the device in a known OS/FW version state and running SDT to verify fault:

a. Replace the device’s internal rSSD with a BMR imaged rSSD containing latest OS and FW updates (not supplied – must be created as a fault verification jig/tool).

b. Run SDT and verify if condition persists or if resolved with use of BMR imaged drive.

i. If problem is resolved, then re-image original rSSD or replace original rSSD and image.

The battery bears a warning label with the following information:

Battery is replaceable by trained personnel; replacement must follow Microsoft procedure.

See http://aka.ms/surface-safety for important information.

– Risk of fire or burning – contact Microsoft for assistance

– Do not modify battery, its wiring, or connectors

– Do not short circuit, bend, dent, crush, or puncture battery

– Do not dispose of battery in fire or expose to high temperatures (+140°F/60°C)

Required Tools and Components:

– Tools: 3IP (Torx-Plus) driver, Anti-static wrist strap (1M Ohm resistance), Soft ESD safe mat, Microfiber / Lint free cloth, SIM eject tool (or equivalent 0.023 in / 0.58 mm diameter paperclip).

– Components: rSSD (Refer to Illustrated Service Parts List).

Prerequisite Steps:

– Power off device – Ensure device is powered off and disconnected from a power supply.

– General Safety – Check to make sure that general guidelines and ESD compliance steps are followed prior to opening device.

Procedure – Removal (rSSD):

1. Remove rSSD door – Use SIM ejector tool.

2. Remove rSSD screw – Use a 3IP (Torx-Plus) driver to remove the screw securing the rSSD.

3. Remove rSSD – The rSSD should lift upwards to ~15-degree tilt after screw is removed. Carefully grab sides of rSSD case and pull out of main board socket at same ~15-degree angle.

Procedure – Installation (rSSD):

IMPORTANT: Only a Microsoft rSSD of like capacity should be replaced in the device.

1. Insert rSSD – Insert the connector end of the rSSD into the rSSD connector on Main board at ~15-degree angle.

2. Install new rSSD screw – Use a 3IP (Torx-Plus) driver to install a new rSSD screw until the screw is just snug and seated, and then turn another 45 degrees (1/8 turn) or until screw is fully fastened.

3. Replace rSSD door.

4. Imaging – Image the new rSSD by using a BMR Imaging USB drive specific to the device model.

5. Run SDT – Run SDT to ensure all device features and functions operate as expected.

Prerequisite Steps:

– Using an Internet connection, install all available updates: Navigate to Settings -> Update and Security and check for Windows Update.

– For Consumer using Windows Home: The Bitlocker recovery key is automatically generated for users with an MSA. If the user does not have an MSA based account, the disk will not be encrypted.

– For Commercial using Windows Pro: This is managed via commercial policy, and each business may have their own bitlocker policy / recovery method.

– Confirm that the customer knows the Windows password to the device.

– Ensure general safety and ESD compliance steps are followed.

Procedure – Swap (rSSD):

1. Manage Bitlocker:

a. If rSSD remains encrypted during swap:

i. Navigate to Bitlocker > Manage Bitlocker > Generate Bitlocker Recovery Key.

ii. Plug in USB drive.

iii. Save the recovery key to USB storage.

iv. Remove the USB drive.

b. If rSSD can be unencrypted before swap:

i. Navigate to Bitlocker > Manage Bitlocker.

ii. Select Turn Off Bitlocker.

2. Shut down customer’s old device and remove SIM/rSSD door on new device – Use SIM ejector tool.

3. Remove SIM (if present in customer’s old device) – Push edge of SIM card to release from device.

4. Remove rSSD screw from both devices – Use a 3IP (Torx-Plus) driver to remove the screw securing the rSSD. Take care not to damage the screw; it will be reused.

5. Remove rSSD from both devices – The rSSD should lift upwards to ~15-degree tilt after screw is removed. Carefully grab sides of rSSD case and pull out of main board socket at same ~15-degree angle.

6. rSSD Swap – Insert rSSD removed from the new device into customer’s original device, then insert customer’s original rSSD into new device. Insert the connector end of the rSSD into the rSSD connector on Main board at ~15-degree angle.

7. Install rSSD screws in both devices – Use a 3IP (Torx-Plus) driver to install the rSSD screw until it is just snug and seated, and then turn another 45 degrees (1/8 turn) or until screw is fully fastened.

8. Install SIM (if present from the customer’s old device in the new device).

9. Replace SIM/rSSD door on both devices.

10. Plug new device into power and wired Internet connection.

11. Power on new device. The device may go through a firmware update during startup.

12. If the SSD remained encrypted during the swap:

a. Plug in USB drive with Bitlocker recovery key.

b. Open the .txt file with the Bitlocker recovery key.

c. Manually enter the recovery key into the new device.

13. Connect a keyboard to the new device.

14. Navigate to Sign-In Options -> Password (key icon on the left side).

15. Customer enters Windows password. Select “Sign In”.

16. Customer may need to go through two-factor authentication.

17. Once fully signed in, navigate to Start -> Account -> Sign Out.

18. Customer signs in with Windows password again.

19. Customer prompted to setup Windows Hello and PIN.

a. If the device was previously Bitlockered, navigate to Bitlocker > Manage Bitlocker > Resume Bitlocker.

20. Run SDT – Run SDT to ensure all device features and functions operate as expected.

21. Check Windows activation – Navigate to Settings > Activation. If there is any error message, select Troubleshoot.

22. Check Office Account – Open Office app and then navigate to File > Account and check for any error messages.

23. Check cellular (if SIM present) – Unplug device from wired network and disable WiFi. Check that cellular network shows connected, and that the device can open a webpage.

24. Return customer’s original device per established procedures.

Procedure – Removal (Kickstand):

1. Place device screen-down on soft ESD-safe mat. Ensure mat is clear of any abrasive material that may scratch the Touch Display Module (TDM) glass.

2. Extend the kickstand to approximately 90 degrees.

3. Remove hinge screws – Use your finger to hold the back of the kickstand behind the hinge while removing the hinge screws. One screw for each hinge. Ensure screws do not fall into the hinge opening.

4. Angle Kickstand Down – Firmly grip the hinges and the kickstand between thumb and index fingers. Rotate the kickstand from 90 degrees to approximately 45 degrees.

5. Release Kickstand Threaded Bosses – Using fingers on the underside of the kickstand and thumb on the topside, slightly rotate the kickstand about the axis. The kickstand should rotate ~5 degrees to free the two threaded bosses of the kickstand from the recesses of the hinges.

6. Remove Kickstand – Using the palm of your hand, firmly hold the device down from the center of the IBC. Simultaneously, grip the kickstand off-center between your thumb and index finger and firmly pull. Pull with a moderate amount of force until the foam inserts slide out of the device. If the kickstand is stuck, ensure the threaded bosses has not slipped back into the recess on the hinges.

WARNING: Inspect Removed Kickstand Foam Tabs – Damaged foam or tabs cannot be safely removed. Attempts to do so can damage internal components. Do not insert anything other than the tabs into the slots. Ensure both tabs are complete and show no signs of tearing. If tabs show signs of tearing, part of the foam may still be inside the device. Before proceeding, all foam must be removed from the device. Foam left inside will require whole unit exchange.

Procedure – Installation (Kickstand):

1. Insert Foam Tabs – With the hinges still at ~45 degrees start to slide the new kickstand’s foam tabs into the slots on the back of the IBC. Foam should slide in with minimal force. Do not slide the foams completely into the device—insert the foam tabs until ~3/4 of the foam tabs are inside the device. CAUTION: Do not use any tool or sharp object to assist inserting the tabs into the slots.

2. Slot Outer Lip of Hinge into Kickstand – Using fingers on the underside of the kickstand and thumb on the topside, slightly rotate the kickstand about the axis as shown below. The kickstand should rotate ~5 degrees to catch the outer lip of the hinge. Push the kickstand toward the device.

3. Slip Kickstand Threaded Bosses into Hinge Recesses – Maintaining pressure on the kickstand to prevent it from backing out, rotate the kickstand down into place. The threaded bosses of the kickstand should slip into the recesses of the hinges.

4. Rotate the Kickstand Up – Firmly grip the hinges and the kickstand between thumb and index fingers. Rotate the kickstand from 45 degrees to approximately 90 degrees.

5. Apply thread locker to screws – Brush new screws with Loctite SF 7649 Activator. Let screws sit for 2 minutes after activator is applied before assembling to device.

6. Apply thread locker to screws bosses – Apply one drop of Loctite 243 thread locker to each screw boss.

7. Install hinge screws – Use your finger to hold the back of the kickstand behind the hinge while installing the screws until they are fully seated. Ensure the kickstand is properly aligned and seated in the hinges, then tighten the screws an additional ~quarter turn (~90 degrees). Be careful to tighten the screws only until snug and not to strip the kickstand threads. Ensure screws do not fall into hinge opening.

8. Final inspection Kickstand installation – Fold the kickstand down and peel off protective plastic from the kickstand and logo if present. Verify the side edges of the kickstand are aligned with the midframe walls and that there are no obvious steps/gaps between the kickstand and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.

Prerequisite Steps:

1. Prep Device – Device must be set in TDM Replacement Mode prior to removing a faulty TDM.

a. Connect software tools USB drive with SDT to USB connector on device under repair.

b. Connect power supply to device.

c. Power on device.

d. Run software tool: SDT – Select Repair setup and validation. Run the Touch Display Setup. At the end of the tool process device will power down. This step must be carried out successfully before removal of a faulty TDM.

2. Power off device and disconnect all cables.

3. Remove rSSD.

Procedure – Removal (TDM):

1. Speaker Mesh Preparation – Place the device face up on a Soft ESD safe mat. Use an iFixit opening tool to widen the gap between the right speaker mesh and device. Push the sharp edge into the gap and slide side to side. Once the flat tip fits fully, use it to push the speaker mesh towards the device. Repeat for left speaker mesh.

2. Debonding TDM Marking Pick Depth – Using a metric ruler draw a 2 mm mark and 8 mm mark on the plastic pick.

3. TDM Debonding Tool Setup:

a. Install marked pick in the holder with the marks in view. Use a 3 mm Allen Driver to adjust pick height to the lowest setting.

b. Clamp debonding tool to edge of workbench.

c. Place the right side speaker edge of the device in the debonding tool above the pick. Adjust the pick height to the 2 mm mark.

d. With both hands draw the right side of the device thru the debonding tool track.

e. At the bottom right corner rotate the device in the debonding tool track. Draw the bottom side of the device thru the debonding tool track.

f. At the bottom left corner rotate the device in the debonding tool track. Draw the left side of the device thru the debonding tool track.

g. At the top left corner rotate the device in the debonding tool track. Draw the top side of the device thru the debonding tool track.

h. Place the top left edge of the device in the debonding tool track. Adjust the pick height to the 8 mm mark. With both hands draw the top edge of the device thru the debonding tool track.

CAUTION: Do not insert the pick more than 2 mm along the left and right sides or bottom edge of the TDM. The pick depth should not exceed 8 mm along the top edge of the TDM.

4. Separate TDM from IBC – Gently pull up vertically on the top edge of the glass while pushing down on the IBC to separate the glass. Lift the edges of the TDM and inspect for any remaining PSA. Slice or remove any strands still connecting the TDM to the IBC.

5. Disconnect TDM FPC – While supporting the TDM with one hand, remove the shield lid on the TDM FPC by inserting pointed end of a spudger underneath the inner edge of the shield. Disconnect the TDM FPC using the pointed end of a spudger.

6. Remove Speaker Mesh from IBC – Remove any remaining speaker mesh from the IBC using a handheld pick.

7. Remove Residual IBC PSA – Using IPA and cotton swabs clean residual PSA off the IBC. Ensure area around the Camera and IR Sensor is clean.

Procedure – Installation (TDM):

1. Pre-installation Device Inspection – Verify the battery’s condition. Devices exhibiting battery issues require whole unit replacement. Leave protective cling on new TDM. Inspect internal areas of the bucket.

2. TDM PSA Application – Thoroughly clean the IBC along the TDM PSA bonding surface using IPA and a cotton swab. Wait at least 30 seconds. Apply the 4 strips of PSA to the IBC following the outline. Leave the blue liner on the PSA.

3. Speaker Mesh Application – Place the TDM face-down on a Soft ESD safe mat. Wipe down the outer edges. Remove the protective liner from the speaker mesh. Align the speaker mesh into the TDM speaker opening. Press onto the mesh for 10 seconds. Repeat for the other side.

4. Connect TDM FPC – Connect the TDM FPCs by pressing it into the mating connector on the reverse side of the TDM. Install a new shield over the TDM FPC.

5. Apply TDM to Bucket – Hover the TDM and remove the PSA Liners. Turn the TDM over and place it on the IBC. Align the TDM along the top edge first (Toe-in) and lower. Ensure the glass sits flush.

6. Bonding PSA – Place the bonding frame on the device. Place foam pad over bonding frame. Place 23 kg of weight on top of the foam pad and bonding frame for 1 minute.

7. After Bonding Inspection – Remove the weights, foam pad, and the frame. Inspect the TDM for scratches, cracks, large gaps, and flushness.

8. Install rSSD.

9. New TDM Calibration – On installation of a new TDM, final calibration is required. Connect the software tools USB drive, power on the device, and run: SDT – Select Repair setup and validation. Run the Touch Display Calibration. Accept the restart prompt.

10. Run SDT to ensure all device features and functions operate as expected.

11. Final inspection TDM installation – Remove protective cling from the new TDM. Verify flushness and wipe the device with a microfiber cloth.

This procedure follows the standard installation up to the bonding step, but uses an alternate method for bonding.

1. Pre-installation Device Inspection: Verify battery condition, leave cling on new TDM, and inspect internal areas.

2. TDM PSA Application: Clean the IBC, wait 30 seconds, and apply the 4 PSA strips, leaving the blue liner on.

3. Speaker Mesh Application: Place TDM face-down, clean edges, apply speaker mesh, press for 10 seconds. Repeat on other side.

4. Connect TDM FPC: Connect the FPCs and install a new shield.

5. Apply TDM to Bucket: Remove PSA liners, align TDM top-edge first, and lower it into place, ensuring it sits flush. Lightly press on the edges to create an initial bond.

6. Alternate Bonding PSA: This is a multi-step process using steel shot bags.

– IMPORTANT: Use steel shot bags, one 9 kg and one 14 kg. Apply the 9 kg bag, and then the 14 kg bag.

– Place the foam pad with the bonding frame face down.

– Place the device display side down into the bonding frame.

– Place the 9 kg steel shot bag onto the device.

– Place the 14 kg steel shot bag onto the 9 kg steel shot bag.

– Bond for 1 minute.

7. After Bonding Inspection: Remove the steel shot bags and lift the device out of the frame. Inspect the TDM for scratches, cracks, large gaps, and flushness.

8. Install rSSD.

9. New TDM Calibration: Perform the final calibration for a new TDM using the SDT tool.

10. Run SDT to ensure all functions operate as expected.

11. Final Inspection: Remove protective cling, verify TDM alignment, and wipe the device clean.

Prerequisite Steps:

– Power off the device and ensure it is disconnected from power.

– Follow general safety and ESD compliance steps.

– Remove the TDM.

Procedure – Removal (THM):

1. Disconnect fan from PCBA – Using a plastic spudger, release the locking bar and slide the zif connector from the PCBA.

2. THM screw removal – Use a 3IP (Torx plus) driver to remove the 12 THM screws.

3. Release TIM from PCBA – Using a plastic spudger apply light pressure to the edges of the THM copper shield on the PCBA. Carefully lift THM from the center copper shield and fan area. Note that shield spring gasket may also come off with the THM copper shield.

4. Clean TIM from SoC – Using a plastic spudger, scrape TIM from SoC area. Use IPA and cotton swab to clean SoC of residual TIM.

Procedure – Installation (THM):

1. Spring gasket placement – If the original gasket appears damaged replace it with a new spring gasket. Ensure the spring gasket is correctly placed over the PCBA then center and align the THM copper shield to the spring gasket.

2. Secure copper shield to gasket – Press THM along edges of copper shield cover to snap it in place over the PCBA.

3. Install new THM screws (Model LTE 1982) – Use a 3IP (Torx-Plus) driver to install the 12 screws until just snug and seated, and then turn another 45 degrees (1/8 turn) or until screws are fully fastened. Refer to the screw locations and part numbers in the manual diagrams.

4. Apply left side fan foams (Model LTE 1982) – Install new foam strip as pictured in the manual.

5. Connect fan to PCBA – Ensure the fan connector locking tab is up. Slide the fan FPC into the zif connector on the PCBA. Press down on the locking tab to secure it.

6. Install TDM.

7. Run SDT – Run SDT to ensure all device features and functions operate as expected.

Prerequisite Steps:

– Power off the device and disconnect from power.

– Follow general safety and ESD compliance steps.

– Remove the TDM.

– Remove the THM.

Procedure – Removal (Surflink):

1. Heat spreader tape removal – Remove heat spreader tape covering Surflink. Note tape size is not the same between WiFi and LTE models.

2. Disconnect FPC from PCBA – Use a spudger to release the locking bar and disconnect the Surflink connector from the PCBA.

3. Screw removal – Use a 6IP (Torx plus) driver to remove the Surflink screws.

4. Surflink removal – Remove Surflink from IBC.

Procedure – Installation (Surflink):

1. Install new Surflink – Install new Surflink into IBC.

2. Install screws – Use a 6IP (Torx-Plus) driver to install the Surflink screws until just snug and seated, and then turn another 45 degrees (1/8 turn) or until screws are fully fastened.

3. Connect FPC to PCBA – Connect Surflink cable to PCBA. Press down on the locking buckle to secure the connector.

4. Install new heat spreader tape – Apply new heat spreader tape to the Surflink. Ensure the notched corners are aligned next to the battery.

5. Install THM.

6. Install TDM.

7. Run SDT – Run SDT to ensure all device features and functions operate as expected.

All waste electrical and electronic equipment (WEEE), waste electronic components, waste batteries, and electronic waste residuals must be managed according to applicable laws and regulations.