MICROSOFT SURFACE PRO 8 WIFI PLATINUM AND GRAPHITE 1983 (01) PDF Document

The following terms are used for servicing the MICROSOFT SURFACE PRO 8 WIFI PLATINUM AND GRAPHITE 1983:

rSSD – Removable Solid-State Drive

TDM – Touch Display Module is the complete screen with all layers.

THM – Thermal Module is an assembly with heat spreaders and electric fan.

TIM – Thermal interface material used between the THM and PCBA.

PCBA – Primary circuit board assembly

SoC – System-on-a-chip is a microchip with several electronic circuits and parts on a single integrated circuit.

PSA – Pressure Sensitive Adhesive

IBC – Tablet Back Cover

BMR – Bare Metal Recovery refers to the clean imaging process.

SDT – Surface Diagnostic Toolkit

ESD – Electro-Static Discharge

FRU – Field Replaceable Units are sub-system components such as the SIM/rSSD door, Kickstand, and rSSD. FRUs are available only to ASPs. Some replaceable units will only be available as FRUs and therefore are only supported at an ASP.

Commercial Spares/CRU – Customer Replaceable Units available to commercial customers for repair by a skilled-technician.

Microsoft Service Tools:

SIM eject tool (or equivalent 0.023 in / 0.58 mm diameter paperclip)

Surface dock

TDM PSA debonding tool (M1214770-001)

TDM PSA bonding frame (M1178722-001)

Surface Diagnostic Toolkit

Standard Service Tools:

Anti-static wrist strap (1 MOhm resistance)

Soft Electro-Static Discharge (ESD) safe mat

iFixit pick

iFixit opening tool

Spudger

Two 2 in spring clamps

TDM Bonding weight

Weight Requirement: minimum 23 kg (50 lb) / maximum 26 kg (57 lb)

Minimum Dimensions: 280 mm x 200 mm (11 in x 8 in)

Geometry must be symmetrical, to allow for even weight distribution.

Weight used must be a flat plate, with consistent flatness and not protrude from contact plane with Bonding Frame.

Weight must contact the full perimeter of the frame when placed above it.

Recommended weights Ruck Plates of 9 kg + 14 kg (20 lb + 30 lb)

Foam pad

Material: EVA Foam

Thickness: 9.5 mm (3/8 in)

Density: 0.03 g/cm³ (2 lb/cu Ft)

Dimensions: Minimum 229 mm x 305 mm (9 in x 12 in)

Recommended foam pad (McMaster PN: 86095K43)

3IP and 6IP (Torx-Plus) drivers

Loctite SF 7649

Loctite 243

Isopropyl alcohol dispenser bottle (use 91% or greater IPA)

Cotton swab

USB drive

Wired Ethernet connection to the Internet

USB keyboard

Microfiber / lint free cloth

Always observe the following general safety precautions:

Opening and/or repairing any electronic device can present a risk of electric shock, fire, serious personal injury, death, damage to the device or other property, and/or other hazards. Exercise caution when undertaking repair activities.

Improper use or handling of devices or their batteries may result in fire or explosion. Only open the enclosure on a device as outlined in the guide.

Do not heat, puncture, mutilate, or dispose of devices or their batteries in fire. Do not leave or charge devices in direct sunlight or expose devices or their batteries to temperatures outside the recommended operating range of 0° C to 60° C/32° F to 140° F for an extended period. Doing so can result in battery failure, electric shock, fire, serious personal injury, death, and/or damage to the device or other property.

We recommend wearing protective eyewear and gloves when disassembling/re-assembling a device.

Before beginning a repair, follow these specific precautions:

WARNING: Before opening a device, ensure it is powered off and disconnected from its power source. Disconnect the device charger or power cord from mains power.

For devices with rechargeable lithium-ion batteries that power on, fully discharge the battery before beginning repair. To expedite the battery discharge process:

Disconnect the charger from the device.

Increase display brightness to the highest level.

Turn on wi-fi and Bluetooth.

Open the Camera app in Windows.

Play music or video files from a local drive or streaming service.

Operate the device in this mode until the battery is fully discharged and the device powers off.

WARNING: For Surface devices where the battery is affixed to the back cover, place the back cover with the battery in a location where it will be protected from possible punctures, impacts, crushing, or drops during the repair process.

Ensure your work surface is level/flat and covered with ESD-safe, soft, non-marring material.

We recommend wearing protective eyewear as a safety precaution when disassembling/re-assembling a device.

Clean your work surface regularly to remove debris and abrasive particles.

Before opening a device, always wear an anti-static wrist strap and confirm your work area is properly grounded to protect vulnerable electronics from electrostatic discharge (ESD).

Parts removed from a device during the repair process should be stored in ESD-safe bags and packaged for return or recycling in the same packaging that the new replacement part came in.

If battery damage (e.g., leaking, expansion, folds or other) is discovered during device repair or if the battery is impacted or damaged during replacement, DO NOT proceed.

As you remove each subassembly from the device, place the subassembly (and all accompanying screws) away from the work area to prevent damage to the device or to the subassembly.

During all activities check to ensure that no loose articles are on the back cover or remain inside the device before reassembling it.

IMPORTANT: Remove rSSD (removable Solid-State Drive) whenever C-cover is removed from device. rSSD removal disconnects the battery from all device logical components for safety purposes.

IMPORTANT: Whenever the rSSD has been removed, powering on the device requires that the rSSD and C-cover are installed.

Use the following best practices when handling batteries:

Always fully discharge batteries by running an application such as video playback with the device unplugged. If the device does not function while unplugged, you may leave out this step.

Do not puncture, impact, strike, bend, or crush the battery or a device containing a battery.

Keep your workspace clear of debris, extra tools, and sharp objects.

Exercise caution when using sharp tools near the battery to avoid impacting or poking the battery.

Don’t leave loose screws or small parts inside the device.

Avoid using tools that conduct electricity.

Do not drop or throw a lithium-ion battery.

Do not expose the battery to excessive heat, sunlight, or temperatures outside the battery’s normal operating range (0° C to 60° C)/(32° F to 140° F).

Ensure you handle, recycle, and/or dispose of used or damaged batteries in accordance with local laws and regulations.

If device repair cannot be completed immediately and the device needs to be stored temporarily before restarting the repair:

Select a storage location and process that follows the battery safety precautions in this Guide.

Avoid exposing the device to environmental conditions and objects that could damage the battery pack.

Reinspect the battery pack as outlined in this Guide prior to restarting repair and installing the new battery pack.

Upon opening the device, visually inspect the battery for signs of damage. Factors to consider include, but are not limited to:

Evidence of leaking or venting

Visible signs of physical or mechanical damage, such as:

Expansion or swelling. In expanded or swollen batteries, the soft pouch encasing the cell pulls away from the inner material and appears baggy, loose, or puffy.

Discoloration of the battery casing.

Odor, smell, or visible corrosion. Leaked battery electrolyte smells like nail polish remover (acetone).

Dents along the battery cell edges or on the top surface.

Surface scratches that have exposed the aluminum beneath the black coating layer on the battery.

Loose or damaged wires.

Known misuse or abuse.

Any battery exhibiting these signs must be replaced.

DO NOT dispose of used lithium-ion batteries, whether damaged or not, in household or commercial garbage or recycling bins.

WARNING: DO NOT SHIP DAMAGED OR DEFECTIVE BATTERIES ALONE OR INSIDE DEVICES. Damaged or defective batteries and devices containing damaged or defective batteries require special packaging and handling. Prior to transport:

Follow all instructions provided by your local e-waste recycling or household hazardous waste collection provider.

Place the device or battery in an individual, non-metallic inner packaging, such as a zip-to-close plastic bag, that completely encloses the device or battery.

Surround the inner packaging with non-combustible, electrically non-conductive, absorbent cushioning material.

Each damaged battery or device containing a damaged battery should be packed individually in its own carton and that carton should be clearly marked as containing a damaged battery.

Undamaged, used lithium batteries can be sent to e-waste recycling or household hazardous waste collection points for processing.

A thermal event is a rapid chemical chain reaction that can occur inside a battery cell. Act immediately if you see any of the following symptoms:

Smoke, soot, sparks, or flame emitted by the battery or from a device containing a battery.

The battery pouch suddenly expands in size.

A popping or hissing noise from the battery or a device containing a battery.

Actions to take:

DO NOT use water. Immediately smother the battery or device with clean, dry sand, a fire blanket, or an appropriate (Class B) fire extinguisher. If using sand, dump the sand all at once until the device is completely covered.

Contact local fire authorities if further assistance is needed.

Exit the work area and ventilate it until it is clear of smoke.

Wait at least 2 hours before attempting to touch the device.

Dispose of the damaged battery or device in accordance with local environmental or e-waste laws and guidelines.

If any Microsoft device visually exhibits any of the following symptoms, cease all further repair efforts and contact Microsoft Surface Customer Support to report and obtain next steps:

Any burned or melted components, traces, or plastic parts on the outside of the device, or which otherwise exhibits heat damage, including charring seen in charging and other ports.

Any burned or melted components, traces, or plastic parts on the inside of the device, or which otherwise exhibits heat damage.

Any accessories exhibiting melting or heat damage that are included with the Microsoft device, such as power supplies, keyboards, mice, cables, charging connectors, etc.

Any devices that exhibit a case that has separated apart or opened for reasons other than impact damage from dropping, evidence of tampering, or separation caused by a malfunctioning battery.

Any other finding that may constitute a safety hazard to the user, such as sharp edges on plastics.

IMPORTANT: Device service part availability is segmented into two groups. FRUs are parts available for repair activity through an Authorized Service Provider under specific contract with Microsoft. CRUs/Spares are parts available for repair activity by a skilled technician.

The following approach should be considered when troubleshooting your device:

1. Update device to latest OS/FW versions using the SDT tool.

IMPORTANT: Device updates are required as a prerequisite to all hardware replacement.

2. Verify any suspected hardware failures by setting the device in a known OS/FW version state and running SDT to verify fault:

a. Replace the device’s internal rSSD with a BMR imaged rSSD containing latest OS and FW updates (not supplied – must be created as a fault verification jig/tool).

b. Run SDT and verify if condition persists or if resolved with use of BMR imaged drive.

i. If problem is resolved, then re-image original rSSD or replace original rSSD and image.

The battery bears the following warning label:

Battery is replaceable by trained personnel; replacement must follow Microsoft procedure.

Risk of fire or burning – contact Microsoft for assistance

Do not modify battery, its wiring, or connectors

Do not short circuit, bend, dent, crush, or puncture battery

Do not dispose of battery in fire or expose to high temperatures (+140°F/60°C)

Follow these steps for rSSD replacement. Required tools include a 3IP (Torx-Plus) driver and a SIM eject tool.

Procedure – Removal (rSSD)

1. Ensure the device is powered off and disconnected from a power supply.

2. Remove rSSD door – Use a SIM ejector tool.

3. Remove rSSD screw – Use a 3IP (Torx-Plus) driver to remove the screw securing the rSSD.

4. Remove rSSD – The rSSD should lift upwards to a ~15-degree tilt after the screw is removed. Carefully grab the sides of the rSSD case and pull it out of the main board socket at the same ~15-degree angle.

Procedure – Installation (rSSD)

IMPORTANT: Only a Microsoft rSSD of like capacity should be replaced in the device.

1. Insert rSSD – Insert the connector end of the rSSD into the rSSD connector on the Main board at a ~15-degree angle.

2. Install new rSSD screw – Use a 3IP (Torx-Plus) driver to install a new rSSD screw until it is just snug and seated, and then turn another 45 degrees (1/8 turn) or until the screw is fully fastened.

3. Replace rSSD door.

4. Imaging – Image the new rSSD by using a BMR Imaging USB drive specific to the device model.

5. Run SDT – Run SDT to ensure all device features and functions operate as expected.

Prerequisite Steps:

Using an internet connection, install all available updates: Navigate to Settings -> Update and Security and check for Windows Update.

Manage Bitlocker: Obtain the Bitlocker recovery key if the drive is encrypted. It is automatically generated for users with an MSA. For commercial users, this is managed via commercial policy.

Confirm the customer knows the Windows password to the device.

Procedure – Swap (rSSD)

1. Manage Bitlocker on the customer’s old device. If the rSSD will remain encrypted, generate a Bitlocker Recovery Key and save it to a USB drive. If the rSSD can be unencrypted, turn off Bitlocker.

2. Shut down the customer’s old device and remove the SIM/rSSD door on the new device using a SIM ejector tool.

3. Remove the SIM card (if present) from the customer’s old device by pushing the edge of the SIM card to release it.

4. Remove the rSSD screw from both devices using a 3IP (Torx-Plus) driver. The screw will be reused.

5. Remove the rSSD from both devices. The rSSD should lift to a ~15-degree tilt. Pull it out of the main board socket at the same angle.

6. Perform the rSSD Swap: Insert the rSSD removed from the new device into the customer’s original device. Then, insert the customer’s original rSSD into the new device at a ~15-degree angle.

7. Install rSSD screws in both devices. Use a 3IP (Torx-Plus) driver to install the screw until it is just snug, then turn another 45 degrees (1/8 turn).

8. Install the SIM card (if present from the old device) into the new device.

9. Replace the SIM/rSSD door on both devices.

10. Plug the new device into power and a wired Internet connection.

11. Power on the new device. It may go through a firmware update during startup.

12. If the SSD remained encrypted, plug in the USB drive with the Bitlocker recovery key and manually enter it into the new device.

13. Connect a keyboard to the new device.

14. Navigate to Sign-In Options -> Password.

15. The customer enters their Windows password and selects “Sign In”.

16. The customer may need to go through two-factor authentication.

17. Once fully signed in, navigate to Start -> Account -> Sign Out.

18. The customer signs in with their Windows password again.

19. The customer will be prompted to set up Windows Hello and PIN. If the device was previously Bitlockered, navigate to Bitlocker -> Manage Bitlocker -> Resume Bitlocker.

20. Run SDT to ensure all device features and functions operate as expected.

21. Check Windows activation: Navigate to Settings -> Activation. If there is an error message, select Troubleshoot.

22. Check Office Account: Open the Office app, navigate to File -> Account, and check for any error messages.

23. Return the customer’s original device per established procedures.

Procedure – Removal (Kickstand)

1. Place the device screen-down on a soft ESD-safe mat.

2. Extend the kickstand to approximately 90 degrees.

3. Remove hinge screws. Use your finger to hold the back of the kickstand behind the hinge while removing the hinge screws (one screw for each hinge). Ensure screws do not fall into the hinge opening.

4. Angle Kickstand Down. Firmly grip the hinges and kickstand and rotate it from 90 degrees to approximately 45 degrees.

5. Release Kickstand Threaded Bosses. Using fingers, slightly rotate the kickstand about 5 degrees to free the two threaded bosses from the recesses of the hinges.

6. Remove Kickstand. Using the palm of your hand, hold the device down from the center. Grip the kickstand off-center and firmly pull until the foam inserts slide out of the device.

WARNING: Inspect the removed kickstand foam tabs. Damaged foam or tabs cannot be safely removed. Ensure both tabs are complete and show no signs of tearing. If torn, part of the foam may still be inside the device. All foam must be removed before proceeding.

Procedure – Installation (Kickstand)

1. Insert Foam Tabs. With the new kickstand hinges at ~45 degrees, slide the foam tabs into the slots on the back of the device. Insert the tabs until about 3/4 of the way in. Do not use excess force.

CAUTION: Do not use any tool or sharp object to assist inserting the tabs into the slots. Only the tabs should be inserted.

2. Slot Outer Lip of Hinge into Kickstand. Rotate the kickstand about 5 degrees to catch the outer lip of the hinge. Push the kickstand toward the device.

3. Slip Kickstand Threaded Bosses into Hinge Recesses. While maintaining pressure, rotate the kickstand down into place so the threaded bosses slip into the recesses of the hinges.

4. Rotate the Kickstand Up. Firmly grip the hinges and kickstand and rotate from 45 degrees to approximately 90 degrees.

5. Apply thread locker to screws. Brush new screws with Loctite SF 7649 Activator. Let screws sit for 2 minutes.

6. Apply thread locker to screw bosses. Apply one drop of Loctite 243 thread locker to each screw boss.

7. Install hinge screws. Use your finger to hold the back of the kickstand behind the hinge while installing the screws until they are fully seated. Tighten the screws an additional ~quarter turn (~90 degrees). Do not over-tighten or strip the threads.

8. Final Inspection. Fold the kickstand down and peel off any protective plastic. Verify the side edges are aligned with the midframe walls with no obvious steps/gaps. Wipe the device with a microfiber cloth to remove fingerprints.

Prerequisite Steps:

1. Prep Device: The device must be set in TDM Replacement Mode prior to removing a faulty TDM. Connect a USB drive with SDT, connect power, and power on the device. Run SDT, select Repair setup and validation, and run the Touch Display Setup. The device will power down upon completion.

IMPORTANT: This step must be carried out successfully before removing a faulty TDM.

2. Power off the device and disconnect all cables.

3. Remove the rSSD.

Procedure – Removal (TDM)

1. Speaker Mesh Preparation: Place the device face up. Use an iFixit opening tool to widen the gap between the speaker mesh and the device. Push the sharp edge into the gap and slide it side to side. Once the tip fits fully, use it to push the speaker mesh towards the device, repeating along the length. Repeat for the other speaker mesh.

2. Mark Pick Depth: Using a metric ruler, draw a 2 mm mark and an 8 mm mark on the plastic pick.

3. TDM Debonding Tool Setup:

a. Install the marked pick in the tool’s holder and use a 3 mm Allen Driver to adjust it to the lowest setting.

b. Clamp the debonding tool to the edge of a workbench.

c. Place the right side speaker edge of the device in the tool and adjust the pick height to the 2 mm mark, ensuring it enters the gap between the TDM and the bucket edge.

d. With both hands, draw the right side of the device through the debonding tool track.

e. At the bottom right corner, rotate the device and draw the bottom side through the track.

f. At the bottom left corner, rotate the device and draw the left side through the track.

g. At the top left corner, rotate the device and prepare to draw the top side through.

h. Adjust the pick height to the 8 mm mark. With both hands, draw the top edge of the device through the debonding tool track.

CAUTION: Do not insert the pick more than 2 mm along the left, right, or bottom edges. The pick depth should not exceed 8 mm along the top edge.

4. Separate TDM from IBC: Gently pull up vertically on the top edge of the glass while pushing down on the IBC. Lift the edges and inspect for any remaining PSA. Slice or remove any strands still connecting the TDM to the IBC.

5. Disconnect TDM FPC: Supporting the TDM, remove the shield lid on the TDM FPC with a spudger. Disconnect the TDM FPC with the pointed end of a spudger.

6. Remove Speaker Mesh from IBC: Remove any remaining speaker mesh from the IBC using a handheld pick.

7. Remove Residual IBC PSA: Using IPA and cotton swabs, clean residual PSA off the IBC. Ensure the area around the camera and IR sensor is clean. Wipe with a lint-free cloth.

Procedure – Installation (TDM)

1. Pre-installation Inspection: Verify the battery’s condition. Inspect the internal areas of the bucket for foreign objects. Leave the protective cling on the new TDM.

2. TDM PSA Application: Thoroughly clean the IBC along the bonding surface with IPA. Wait 30 seconds, then apply the 4 strips of PSA to the IBC, following the outline. Leave the blue liner on.

3. Speaker Mesh Application: Place the TDM face-down. Wipe the outer edges. Remove the protective liner from the speaker mesh, align it in the opening, and press for 10 seconds to activate the adhesive. Repeat for the other side.

4. Connect TDM FPC: While supporting the TDM, connect the TDM FPCs. Install a new shield over the FPC, ensuring all edges snap into place.

5. Apply TDM to Bucket: Hover the TDM, remove the PSA liners, and turn it over. Align the TDM along the top edge first (Toe-in) and lower it into place on the IBC. Ensure the glass sits flush.

6. Bonding PSA: Place the bonding frame on the device, ensuring cutouts align with buttons. Place the foam pad over the frame. Place 23 kg of weight on top of the foam pad and leave it for 1 minute.

7. After Bonding Inspection: Remove the weight, foam pad, and frame. Inspect the TDM for scratches, cracks, gaps, and flushness.

8. Install rSSD.

9. New TDM Calibration: On installation of a new TDM, final calibration is required. Connect the USB drive with SDT, power on the device, and run the Touch Display Calibration from the SDT tool. Accept the restart prompt.

10. Run SDT to ensure all device features and functions operate as expected.

11. Final Inspection: Remove the protective cling. Verify the TDM edges are flush with the IBC. Wipe the device with a microfiber cloth.

This procedure provides an alternate method for bonding the TDM using steel shot bags instead of a weight plate.

1. Pre-installation Inspection: Verify the battery’s condition. Inspect the internal areas of the bucket for any foreign objects. Leave the protective cling on the new TDM.

2. TDM PSA Application: Thoroughly clean the IBC along the bonding surface with IPA. Wait 30 seconds, then apply the 4 strips of PSA to the IBC, following the outline. Leave the blue liner on.

3. Speaker Mesh Application: Place the TDM face-down. Wipe the outer edges. Remove the protective liner from the speaker mesh, align it in the opening, and press for 10 seconds to activate the adhesive. Repeat for the other side.

4. Connect TDM FPC: While supporting the TDM, connect the TDM FPCs. Install a new shield over the FPC, ensuring all edges snap into place.

5. Apply TDM to Bucket: Hover the TDM, remove the PSA liners, and turn it over. Align the TDM along the top edge first (Toe-in) and lower it into place on the IBC. Lightly press on the edges of the TDM to create an initial bond.

6. Alternate Bonding PSA: This is a multi-step process.

IMPORTANT: Use steel shot bags, one 9 kg and one 14 kg. Apply the 9 kg bag, and then the 14 kg bag.

a. Place the foam pad with the bonding frame face down.

b. Place the device display side down into the bonding frame.

c. Place the 9 kg steel shot bag onto the device.

d. Place the 14 kg steel shot bag on top of the 9 kg steel shot bag. Bond for 1 minute.

7. After Bonding Inspection: Remove the steel shot bags and lift the device out of the frame. Inspect the TDM for scratches, cracks, large gaps, and its flushness with respect to the IBC.

8. Install rSSD.

9. New TDM Calibration: On installation of a new TDM, final calibration is required. Connect the USB drive with SDT, power on the device, and run the Touch Display Calibration from the SDT tool. Accept the restart prompt.

10. Run SDT to ensure all device features and functions operate as expected.

11. Final Inspection: Remove the protective cling from the TDM. Verify the side edges of the TDM are flush, and that there are no obvious steps/gaps between the TDM and the IBC. Wipe the device thoroughly with the microfiber cloth to remove all fingerprints.

Prerequisite Steps:

Ensure the device is powered off and disconnected.

Follow general safety and ESD compliance steps.

Remove the TDM as detailed in the TDM replacement procedure.

Procedure – Removal (THM)

1. Disconnect fan from PCBA: Using a plastic spudger, release the locking bar and slide the zif connector from the PCBA.

2. THM screw removal: Use a 3IP (Torx plus) driver to remove the 12 THM screws.

3. Model 1983 WiFi Remove left side speaker tape: Remove the tape securing the speaker cable to the fan.

4. Release TIM from PCBA: Using a plastic spudger, apply light pressure to the edges of the THM copper shield on the PCBA. Carefully lift the THM from the center copper shield and fan area.

5. Clean TIM from SoC: Using a plastic spudger, scrape TIM from the SoC area. Use IPA and a cotton swab to clean the SoC of residual TIM.

Procedure – Installation (THM)

1. Spring gasket placement: If the original gasket appears damaged, replace it with a new one. Ensure the spring gasket is correctly placed over the PCBA, then center and align the THM copper shield to the spring gasket.

2. Secure copper shield to gasket: Press the THM along the edges of the copper shield cover to snap it in place over the PCBA.

3. Install new THM screws (Model WiFi 1983): Use a 3IP (Torx-Plus) driver to install the 12 screws until just snug and seated, then turn another 45 degrees (1/8 turn) or until screws are fully fastened. Follow the screw location diagram and part numbers provided in the service guide.

4. Apply left side speaker tape and foams (Model WiFi 1983): Install tape securing the speaker cable to the fan. Install new foams as pictured in the service guide.

5. Connect fan to PCBA: Ensure the fan connector locking tab is up. Slide the fan FPC into the zif connector on the PCBA. Press down on the locking tab to secure it.

6. Install TDM: Install the TDM as detailed in the TDM installation procedure.

7. Run SDT: Run SDT to ensure all device features and functions operate as expected.

Prerequisite Steps:

Ensure the device is powered off and disconnected.

Follow general safety and ESD compliance steps.

Remove the TDM.

Remove the THM.

Procedure – Removal (Surflink)

1. Heat spreader tape removal: Remove the heat spreader tape covering the Surflink. Note the tape size differs between WiFi and LTE models.

2. Disconnect FPC from PCBA: Use a spudger to release the locking bar and disconnect the Surflink connector from the PCBA.

3. Screw removal: Use a 6IP (Torx plus) driver to remove the Surflink screws.

4. Surflink removal: Remove the Surflink from the IBC.

Procedure – Installation (Surflink)

1. Install new Surflink: Install the new Surflink into the IBC.

2. Install screws: Use a 6IP (Torx-Plus) driver to install the Surflink screws until just snug and seated, then turn another 45 degrees (1/8 turn) or until fully fastened.

3. Connect FPC to PCBA: Connect the Surflink cable to the PCBA. Press down on the locking buckle to secure the connector.

4. Install new heat spreader tape: Apply new heat spreader tape to the Surflink. For the WiFi model, ensure the notched corners are aligned next to the battery.

5. Install THM: Install the THM as detailed in its installation procedure.

6. Install TDM: Install the TDM as detailed in its installation procedure.

7. Run SDT: Run SDT to ensure all device features and functions operate as expected.