HP PROLIANT ML350 GENERATION 4P (01) PDF DOCUMENT

HP’s customer self-repair program offers you the fastest service under either warranty or contract. It enables HP to ship replacement parts directly to you so that you can replace them at your own convenience.

The program is convenient and easy to use:

• An HP support specialist will diagnose and assess whether a replacement part is required to address a system problem. The specialist will also determine whether you can replace the part.

• Replacement parts are express-shipped. Most in-stock parts are shipped the very same day you contact HP. You may be required to send the defective part back to HP, unless otherwise instructed.

Customer replaceable parts are identified in the parts catalog tables.

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You need the following items for some procedures:

• Torx T-15 screwdriver

• Flathead screwdriver

• Diagnostics Utility

To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.

• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

• Place parts on a grounded surface before removing them from their containers.

• Avoid touching pins, leads, or circuitry.

• Always be properly grounded when touching a static-sensitive component or assembly.

To access some components and perform certain service procedures, you must perform one or more of the following procedures:

• Extend the server from the rack. If you are performing service procedures in a Compaq branded rack, telco rack, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.

• Power down the server. If you must remove a server from a rack or a non-hot-plug component from a server, power down the server.

• Remove the server from the rack. If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.

IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.

1. Shut down the operating system as directed by the operating system documentation.

2. Press the Power On/Standby button to place the server in standby mode. When the server activates standby power mode, the system power LED changes to amber.

3. Disconnect the power cords.

The system is now without power.

CAUTION: Due to the high capacitance in the power supply, please wait 30 seconds after removing the power cable before opening the access panel.

1. Loosen the thumbscrews that secure the server faceplate to the front of the rack.

IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access internal components.

2. Extend the server on the rack rails until the server rail-release latches engage.

WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack.

CAUTION: Due to the high capacitance in the power supply, please wait 30 seconds after removing the power cable before opening the access panel.

To remove the component:

1. Power down the server.

2. Do one of the following:

a. Remove the server from the rack, if applicable.

b. Remove the tower front bezel, if applicable.

3. Loosen the two thumbscrews on the front panel of the server near the access panel.

4. Slide the access panel back about 1.5 cm (0.5 in).

5. Lift and remove the access panel.

NOTE: Turn the access panel over to locate the System Configuration and Options hood labels. These labels will provide information on installing various options, flexible memory configurations, LED status indicators, and switch settings.

To replace the component, reverse the removal procedure.

To remove the server from an HP, telco, or third-party rack:

1. Power down the server.

2. Loosen the front panel thumbscrews that secure the server faceplate to the front of the rack.

3. Disconnect the cabling and remove the server from the rack. Reverse the server installation steps in the documentation that ships with the rack-mounting option.

4. Place the server on a sturdy, level surface.

1. To remove the feet, lift them up and away from the chassis.

To replace the component, reverse the removal procedure.

This server has a removable front bezel that must be unlocked and opened before accessing the hard drive cage or removing the access panel. The door should be kept closed during normal server operations.

1. Use the key provided with the server to unlock the bezel with a clockwise turn.

2. Open the bezel door.

3. If necessary, remove the front bezel by pulling it away from the chassis.

WARNING: To reduce the risk of electric shock, do not disassemble the power supply or attempt to repair it. Replace it only with the specified spare part.

CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure unless both bays are populated with power supplies.

To remove the component:

1. Remove the power cord from the unit to be removed.

2. Push down on the power supply release latch, and remove the power supply from the server.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To replace the component, reverse the removal procedure.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. Determine the status of the hard drive from the hot-plug hard drive LEDs.

2. Back up all server data on the hard drive.

3. Open the front bezel.

4. Remove the hard drive by pressing the release button, opening the handle, and sliding the drive out of the bay.

To replace the component, reverse the procedure.

Hot-plug SATA and hot-plug SAS hard drives can be used interchangeably when a SAS controller is installed. Before installing a SAS hard drive, you must install a SAS controller. A SATA controller is embedded for use with SATA drives only.

To remove the component:

1. Determine the status of the hard drive:

a. when using the embedded SATA controller, observe the OS logs or the status in POST

b. when using an optional SATA/SAS controller, observe the hot-plug hard drive LEDs

2. Back up all server data on the hard drive.

3. Disconnect the cables from the hot-plug SATA/SAS drive cage (if removing the entire cage).

4. Remove the hard drive by pressing the release button, opening the handle, and sliding it out.

To replace the component:

1. Remove the existing hard drive blank or hard drive from the drive bay.

2. Install the hard drive.

3. Determine the status of the hard drive from the hot-plug hard drive LEDs.

4. Resume normal server operations.

IMPORTANT: If upgrading processor speed, update the system ROM before installing the processor.

IMPORTANT: PPM 2 must be installed when processor 2 is installed. The system fails to boot if the PPM is missing.

To remove a processor and heatsink:

1. Remove the access panel.

2. Disconnect the heatsink connectors from the headers on the system board.

3. Open the heatsink retaining levers.

4. Remove the heatsink.

5. Open the processor locking lever and remove the processor.

To replace the processor and heatsink:

1. Open the processor locking lever, if necessary.

2. Install the processor and close the processor locking lever.

CAUTION: Forcing the processor locking lever could lead to hardware damage.

IMPORTANT: Do not remove the thermal tape from the bottom of the heatsink. Removing the tape will affect the thermal solution and prevent the system from working properly.

3. Install the heatsink.

4. Close the processor retaining brackets.

5. Connect the heatsink connector to the correct header on the system board (Processor 1 or Processor 2).

6. Replace the access panel.

1. Power down the server.

2. Extend the server from the rack, if applicable.

3. Remove the front bezel door, if necessary.

4. Remove the access panel.

5. Open the DIMM slot latches.

6. Remove the DIMM.

To replace the component, reverse the removal procedure.

If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

• Replace only with the spare designated for this product.

To remove the component:

1. Power down the server.

2. Extend or remove the server from the rack.

3. Remove the front bezel door, if necessary.

4. Remove the access panel.

5. Remove the battery by pressing the retaining clip and lifting the battery out.

IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU.

To replace the component, reverse the removal procedure.

After you replace the system board, you must re-enter the server serial number and the product ID.

1. During the server startup sequence, press the F9 key to access RBSU.

2. Select the System Options menu.

3. Select Serial Number. The following warning is displayed:

WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis.

4. Press the Enter key to clear the warning.

5. Enter the serial number and press the Enter key.

6. Select Product ID.

7. Enter the product ID and press the Enter key.

8. Press the Esc key to close the menu.

9. Press the Esc key to exit RBSU.

Press the F10 key to confirm exiting RBSU. The server will automatically reboot.

ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver (Health Driver) is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.

ASR increases server availability by restarting the server within a specified time after a system hang or shutdown. You can disable ASR from the HP SIM console or through RBSU.

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

• From within HP SIM

• From within Survey Utility

• From within operating system-specific IML viewers

– For NetWare: IML Viewer

– For Windows®: IML Viewer

– For Linux: IML Viewer Application

• From within HP Insight Diagnostics

When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.

CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur.

* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.

** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for storage corresponds to a pressure minimum of 70 KPa.

ABEND: abnormal end

ACU: Array Configuration Utility

ADU: Array Diagnostics Utility

ASR: Automatic Server Recovery

ATAPI: Advanced Technology Attachment Packet Interface

DDR: double data rate

DIMM: dual inline memory module

HD68: high density 68

IEC: International Electrotechnical Commission

iLO: Integrated Lights-Out

IML: Integrated Management Log

IPL: initial program load

IRQ: interrupt request

ISEE: Instant Support Enterprise Edition

MPS: multi-processor specification

NEMA: National Electrical Manufacturers Association

NFPA: National Fire Protection Association

NIC: network interface controller

NMI: non-maskable interrupt

NVRAM: non-volatile memory

ORCA: Option ROM Configuration for Arrays

PCI Express: peripheral component interconnect express

PCI-X: peripheral component interconnect extended

PDU: power distribution unit

POST: Power-On Self Test

PPM: Processor Power Module

PSP: ProLiant Support Pack

PXE: preboot eXecution environment

RBSU: ROM-Based Setup Utility

RILOE II: Remote Insight Lights-Out Edition II

SAS: serial attached SCSI

SATA: serial ATA

SCSI: small computer system interface

SDRAM: synchronous dynamic RAM

SIM: Systems Insight Manager

TMRA: recommended ambient operating temperature

UID: unit identification

VHDCI: very high density cable interconnect

WOL: Wake-on LAN